Method and apparatus for increasing uniformity in ion mill process
US7846305B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 1, 2005 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Jul 6, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49046
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for increasing etch depth uniformity in ion milling process in a wafer manufacturing process encompasses loading designated regions of a production pallet with carriers containing wafers to be ion milled. These designated regions have been predetermined to exhibit similar and preferred depths of etching. Non-designated regions of the production pallet are then loaded with dummy carriers and the wafers are ion milled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.