Method for supplying a plating composition with deposition metal ion during a plating operation
US7846316B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2006 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Sep 10, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/22
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Method and plating bath apparatus for setting the ionic strength of a plating composition using Donnan dialysis by flowing the plating composition along a first surface of a membrane while simultaneously flowing a deposition metal ion exchange composition along a second surface of the membrane such that the deposition metal ion crosses the membrane from the deposition metal ion exchange composition to the plating composition while an exchange cation different from the deposition metal ion crosses the membrane from the plating composition to the deposition metal ion exchange composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.