Processing a printed wiring board by single bath electrodeposition
US7846317B2 · kind B2 · utility
8Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2003 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Apr 29, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.