Housing of electronic devices and method
US7846362B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 20, 2008 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Feb 21, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2995/0026
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for making a housing, comprising steps of: providing an mold, the mold including a first female mold and a second female mold setting beside the first female mold, a male mold matingly engageable with the first female mold and the second female mold; the first female mold mating the male mold to form a first mold chamber; injecting molten material into the first mold chamber to form a main body on the male mold; setting a decorative film in the second female mold; rotating the male mold into contact with the second female mold to form a second mold chamber; injecting some transparent resin material into the second mold chamber to form a transparent plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.