Method for coating two elements hybridized by means of a soldering material
US7846770B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 6, 2010 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Jan 6, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method of coating the area of hybridization of a component that is constituted by two elements bonded to one another by means of a soldering material, including depositing proximate to the component a coating substance capable of filling by capillarity action the volume defined between the hybridized elements of the component. Further, along the periphery of the hybridization area on the lower element of the component is an area of non-wettability in regards to the coating substance, that is defined by depositing an anti-wetting covering of PECVD in regards to the coating substance, whereby the anti-wetting covering on the first element encompasses the hybridization area and surrounds a wetting surface for the coating substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.