Multiple row exposed leads for MLP high density packages

US7846774B2 · kind B2 · utility

Assignee

• Carsem (M) SDN. BHD. · MY

Inventors

• Mow Lum Yee · Kuala Kangsar, MY
• Chee Heng Wong · Kuala Kangsar, MY
• Shang Yan Choong · Kuala Kangsar, MY
• Kam Chuan Lau · Kuala Kangsar, MY
• Kok Siang Goh · Kuala Kangsar, MY
• Voon Joon Liew · Kuala Kangsar, MY
• Chee Sang Yip · Kuala Kangsar, MY
• Say Yeow Lee · Kuala Kangsar, MY

Key dates

• Filing date: Aug 18, 2006
• Grant date: Dec 7, 2010
• Expiry date: Oct 7, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe includes die pads that receive the IC chip devices, and each die pad is positioned within multiple rows of connecting pads for connection with bonding pads of the device to be encapsulated. The connecting pads of the leadframe are arranged in an annular fashion, with inner rows being closer to the die pad and outer rows being farther from the die pad.