Method for producing an electronic component
US7846838B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2006 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Jun 2, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for producing an electronic component on a surface of a substrate with the electronic component having, seen at right angles to the surface of the substrate, at least two electrical functional layers which are arranged one above the other and such that they overlap at least in a surface area F, with the at least two electrical functional layers on the substrate being structured directly or indirectly using a continuous process, with a first electrical functional layer of the at least two electrical functional layers being structured such that a first length/width dimension of the first electrical functional layer parallel to the surface of the substrate and in a relative movement direction of the substrate is at least 5 μm longer/wider, preferably more than 1 mm longer/wider, than a length/width dimension of the surface area F in the relative movement direction and parallel to the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.