Method of separating layers of material
US7846847B2 · kind B2 · utility
15Cited by
30References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2007 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | May 30, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lift off process is used to separate a layer of material from a substrate by irradiating an interface between the layer of material and the substrate. According to one exemplary process, the layer is separated into a plurality of sections corresponding to dies on the substrate and a homogeneous beam spot is shaped to cover an integer number of the sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.