Semiconductor device with resistor and fuse and method of manufacturing the same
US7847370B2 · kind B2 · utility
9Cited by
0References
3Claims
0Family size
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Key dates
| Filing date | Feb 7, 2008 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | May 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/47
Abstract
A fuse element is laminated on a resistor and the resistor is formed in a concave shape below a region in which cutting of the fuse element is carried out with a laser. Accordingly, there can be provided a semiconductor device which occupies a small area, causes no damage on the resistor in the cutting of the fuse element, has a small contact resistance occurred between elements, and has stable characteristics, and a method of manufacturing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.