Structure of mounting electronic device into housing
US7848095B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2009 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Jun 4, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B33/124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a structure of mounting an electronic device into a housing according to the present invention, the electronic device has the following structure. First and second storage devices are connected to respective connecting parts provided on a substrate. Convex portions provided on a first supporting member are fitted from above into a gap between the first storage device and the substrate and a gap between the second storage device and the substrate, respectively. Convex portions provided on a second supporting member are fitted from below into the gap between the first storage device and the substrate and the gap between the second storage device and the substrate, respectively. The electronic device into which the first and second supporting members are fitted is inserted into the housing from an opening thereof, and fixed within the housing by the housing and a cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.