System and method for cooling electronic systems
US7848101B2 · kind B2 · utility
11Cited by
19References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2008 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Jan 30, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.