Modular diode laser assembly
US7848372B2 · kind B2 · utility
17Cited by
40References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2008 |
| Grant date | Dec 7, 2010 |
| Priority date | — |
| Expiry date | Feb 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/405
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.