Method of compensating for thermal expansion in SMT interconnects
US7849592B2 · kind B2 · utility
2Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2009 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Mar 13, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of providing end and center locating connectors in interconnects between surface mount technology (SMT) connectors and printed circuit boards (PCBs). The connectors are adapted to maintain their connection even when the printed circuit board and/or the SMT connector expands or contracts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.