Electronic component mounting apparatus and electronic component mounting method
US7850056B2 · kind B2 · utility
1Cited by
23References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2008 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Feb 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1, the shape of a center portion 3a of a tool 3 and the shape of an end portion 3b of the tool 3 are changed such that the cross-sectional areas are different, whereby ultrasonic amplitudes 9 in a direction perpendicular to the direction 5 of ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portion 3a of the tool 3 and at the end portion 3b of the tool 3 can be eliminated or reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.