Semiconductor device and method of manufacturing the same
US7850087B2 · kind B2 · utility
103Cited by
6References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2005 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Oct 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and method of fabricating the same. The semiconductor device includes at least one first contact pin on a first substrate and at least one second contact pin on a second substrate. The at least one first and second contact pins may be included in first and second contact pin arrays. The first and second contact pins of the first and second contact pin arrays may be aligned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.