Polymer particles and conductive particles having enhanced conducting properties, and anisotropic conductive packaging materials containing the same
US7851063B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2007 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Jul 26, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are anisotropic conductive particles contained in anisotropic conductive adhesive films, which can be used in circuit board mounting applications. The conductive particles can exhibit superior electrical reliability. Further disclosed are polymer particles having good compressive deformability and recoverability from deformation without being ruptured when an adhesive film containing conductive particles including the polymer particles as a component is interposed and compressed between connection substrates, thereby achieving a sufficient contact area between the particles and the connection substrates. Because the polymer particles have a spherical shape, a uniform particle diameter, and a narrow particle diameter distribution, the particles can exhibit enhanced conducting properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.