Composition for forming wiring protective film and uses thereof
US7851124B2 · kind B2 · utility
3Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2005 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Jan 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/117
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition for forming a film for protecting wiring which in one aspect includes a polyimide precursor, a compound having at least two photopolymerizable groups, and a photopolymerization initiator, wherein the polyimide precursor includes a polyimide precursor obtained from a diamine component comprising a defined diamine compound. In other aspects, a dry film for forming a wiring-protecting film using the composition and a substrate having wiring protected by means of the dry film are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.