Photosensitive resin composition for pad protective layer, and method for making image sensor using the same
US7851789B2 · kind B2 · utility
7Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2008 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Dec 8, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/033
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a photosensitive resin composition for a pad protective layer that includes (A) an alkali soluble resin, (B) a reactive unsaturated compound, (C) a photoinitiator, and (D) a solvent. The (A) alkali soluble resin includes a copolymer including about 5 to about 50 wt % of a unit having the Chemical Formula 1, about 1 to about 25 wt % of a unit having the Chemical Formula 2, and about 45 to about 90 wt % of a unit having the Chemical Formula 3, and a method of making an image sensor using the photosensitive resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.