Silicon LED package having horn and contact edge with (111) planes
US7851817B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2007 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Mar 6, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/841
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A (100) silicon substrate is prepared having an insulating film formed on front and back surfaces of the silicon substrate. A resist pattern is formed on the insulating film and partially etched to form an etching mask on the front and back surfaces. The silicon substrate is subjected to anisotropical etching dependent upon an orientation to form a concave horn and a through hole, the concave horn having a bottom with a (100) plane and four inclined sidewalls with a (111) plane, and the through hole gradually narrowing from the front and back surfaces toward an inside of the silicon substrate and having a bottleneck portion with the (111) plane at an intermediate position in the silicon substrate. An LED chip is mounted on the bottom of the concave horn to form an LED package. The LED package is provided which presents high wiring reliability and simplified manufacture processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.