Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties
US7851930B1 · kind B1 · utility
6Cited by
8References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 1, 2009 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Jun 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive composition having thermal conductivity as well as excellent dispensability properties is provided. The adhesive composition includes a curable resin component, a curing agent for the curable resin component, and a conductive filler material. The filler material is an alloy of copper and silver. The specific ratios of the copper and silver in the alloy are tailored so as to provide the adhesive composition with appropriate thermal conductivity and dispensing properties making the composition particularly useful for application in the semiconductor industry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.