Methods and apparatuses for improved positioning in a probing system
US7852097B2 · kind B2 · utility
0Cited by
4References
2Claims
0Family size
Inventors
Key dates
| Filing date | Mar 4, 2008 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Jan 29, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2891
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.