Heat sink assembly
US7852631B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 2, 2008 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Jan 26, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly comprises a base consisting of an aluminum casting and a copper base plate, a heat sink consisting of heat fins, and at least a heat guide pipe; the heat guide pipe has a heat dissipation section passing through the heat fins; the aluminum casting has a hollow receiving space accommodating the copper base plate, and an elongated recess is disposed at the top sides of the copper base plate and the casting for placing the heat conduction part of the heat guide pipe; the copper base plate keeps contact the heat source and the heat transmits to the heat guide pipe and then is dissipated with the heat sink via the base rapidly. In addition, the weight of the heat sink assembly is decreased, and the manufacturing cost is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.