Patent · US Active

Sound-attenuating earmuff having isolated double-shell structure

US7854294B2 · kind B2 · utility

9Cited by

11References

6Claims

0Family size

Assignee

Adaptive I/O Technologies, Inc. · US

Inventors

Yu Du · 红钢城街道, CN
Kenji Homma · Sagamihara, JP
Michael A. Vaudrey · Blacksburg, US

Key dates

Filing date	Jan 22, 2010
Grant date	Dec 21, 2010
Priority date	—
Expiry date	Jan 22, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2460/15
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

An earmuff assembly with a double-shell structure is disclosed for use with a sound-attenuating circumaural headset. The earmuff assembly comprises a cup-shaped outer shell mounted on a resilient outer sealing ring and a cup-shaped inner shell mounted on a resilient inner sealing ring. By means of the two sealing rings the outer and the inner shells are brought into abutment with the head surface around an ear of a wearer. Both shells are structurally rigid. The sound attenuation performance is maximized by isolating the inner shell from the outer shell.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.