Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
US7854368B2 · kind B2 · utility
1Cited by
17References
28Claims
0Family size
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Key dates
| Filing date | Oct 24, 2007 |
| Grant date | Dec 21, 2010 |
| Priority date | — |
| Expiry date | Jul 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.