Ceramic packaging for high brightness LED devices
US7854535B2 · kind B2 · utility
15Cited by
19References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2003 |
| Grant date | Dec 21, 2010 |
| Priority date | — |
| Expiry date | Feb 28, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
Abstract
Embodiments of the present invention include a light emitting diode package comprising a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for reducing light leakage. The ceramic LED package further includes a metallic coating on a portion of the ceramic substrate for reflecting light in a predetermined direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.