Method for producing a circuit module comprising at least one integrated circuit

US7855463B2 · kind B2 · utility

Assignee

• Qimonda AG · DE

Inventors

• Martin Brox · Munich, DE
• Simon Muff · Mering, DE

Key dates

• Filing date: Sep 12, 2007
• Grant date: Dec 21, 2010
• Expiry date: Feb 26, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit module comprises a chip, the chip comprising a substrate with a first main area and a second main area, the first main area comprising two half-sets of pads, the chip further comprising an integrated circuit with components and two half-sets of connection lines, the connection lines connecting the components of the integrated circuit to the pads, the integrated circuit further comprising a changeover device, the changeover device having two switching states in order to interchange the electrical assignment between the half-sets of the connection lines and the half-sets of the pads, and a carrier, the carrier comprising contact pieces. The chip is arranged on the carrier with one of the two main areas of the chip facing the carrier and the contact pieces of the carrier are connected to the pads of the chip, wherein one of the two switching states of the changeover device is selected, depending on which of the two main areas of the chip is the area facing the carrier.