Electronic device testing system and method
US7855567B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2008 |
| Grant date | Dec 21, 2010 |
| Priority date | — |
| Expiry date | Nov 4, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/68
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a testing system and method suitable for determining whether the pins of the socket are properly connected to a printed circuit board. The testing system includes a testing signal source, a socket, a signal sensing unit, a fixing element, and an analysis unit. The signal sensing unit comprises a sensor board, a probe, and an operation amplifier. The sensor board is electrically coupled to the socket, and the sensor board has a probing point. The probe is selectively contacted with the probing point of the sensor board for receiving and outputting a sensing signal. The operation amplifier is electrically connected to the probe for receiving, amplifying and outputting the sensing signal. The fixing element is used for fixing the sensor board between the socket and the fixing element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.