High-density patch-panel assemblies for optical fiber telecommunications
US7856166B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2008 |
| Grant date | Dec 21, 2010 |
| Priority date | — |
| Expiry date | Sep 2, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/02342
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Patch panel assemblies (150) that contain patch panel modules (50) for use in optical fiber telecommunication systems are disclosed. One of the patch panel assemblies includes a front mounting frame (210F) and at least one internal mounting frame (210I) that support a plurality of patch panel modules. The patch panel assembly also includes a hinge assembly (224) configured allow bend-insensitive fiber cables (70) to be routed therethrough. One of the patch panel assemblies includes a housing (152) with a drawer (270) that supports a plurality of patch panel modules. The patch panel modules employ bend-insensitive optical fibers (12C) to connect front and rear ports (92, 98) so that the patch panels have a reduced size as compared to conventional patch panel modules. The patch panel assemblies include a cable distribution box (300) that can store excess cable and that assists in routing bend-insensitive fiber optic cables within the patch panel assembly interior (200) in order to connect to select patch panel module jacks (90).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.