System and method for assembling and interconnecting functional components of an active implantable medical device
US7856705B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2007 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Jan 21, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5313
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for mechanical assembly and electrical interconnection of the functional components of an active implantable medical device. A first step involves preparing an interconnection flex circuit (20) that is able to be electrically and mechanically linked to an electronic circuit module (14), a supply battery (12) and a series of feedthrough terminals (16) of the device, prior to being placed in a common case. The flex circuit has a series of pads (34) for linking to homologous metallizations (46) of the substrate. The mechanical assembling and electrical linking of these pads (34) to the metallizations (46) is performed without either the use of any activation flux or introduction of fusible brazing, and rather by applying an intermediate anisotropic conductive material (38) placed between the pads (34) and metallizations (46), followed by polymerizing this material. The applying and polymerizing are performed under controlled conditions of pressure, temperature and duration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.