Photosensitive resin, and photosensitive composition
US7858287B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 30, 2007 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Jul 23, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/123
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin realizes formation of a pattern having a good shape, without introducing poor compatibility between an acid generator and a photoresist primary-component polymer having an acid-dissociable group, and a photosensitive composition containing the photosensitive resin. The photosensitive resin includes a repeating unit represented by formula (1):(wherein R1 represents a C2-C9 linear or branched divalent hydrocarbon group; each of R2 to R5 represents a hydrogen atom or a C1-C3 linear or branched hydrocarbon group; each of R6 and R7 represents an organic group, wherein R6 and R7 may together form a divalent organic group; and X−represents an anion); (wherein R8 represents a C2-C9 linear or branched hydrocarbon group) and a repeating unit represented by formula (3):
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.