Semiconductor device, chip package and method of fabricating the same
US7858438B2 · kind B2 · utility
1Cited by
27References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2007 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Jul 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a chip, a first bump electrode, a conductive wire and a second bump electrode. The chip has at least one contact pad, and the first bump electrode is formed on the contact pad. The conductive wire is disposed on an active surface of the chip and electrically connected to the first bump electrode. The second bump electrode is formed on the conductive wire, and the second bump electrode is not disposed over any contact pad of the chip. In addition, a method for packaging a chip and an IC package are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.