Cleaving edge-emitting lasers from a wafer cell
US7858493B2 · kind B2 · utility
1Cited by
28References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2008 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Apr 19, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0202
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In one example embodiment, a process for cleaving a wafer cell includes several acts. First a wafer cell is affixed to an adhesive film. Next, the adhesive film is stretched substantially uniformly. Then, the adhesive film is further stretched in a direction that is substantially orthogonal to a predetermined reference direction. Next, the wafer cell is scribed to form a notch that is oriented substantially parallel to the predetermined reference direction. Finally, the wafer cell is cleaved at a location substantially along the notch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.