Ethylene-based resin and molded object obtained therefrom
US7858723B2 · kind B2 · utility
3Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2006 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Jan 31, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F4/65927
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Ethylene-based resin, which exhibits a satisfactorily high melt tension and can provide a molded object excellent in mechanical strength, the ethylene-based resin characterized in simultaneously satisfying the requirements [1] to [5] described below:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.