Active pixel sensor having two wafers

US7858915B2 · kind B2 · utility

Assignee

• EASTMAN KODAK COMPANY · US

Inventors

• John P. McCarten · Penfield, US
• Joseph R. Summa · Hilton, US
• Robert M. Guidash · Rochester, US
• Todd J. Anderson · Fairport, US

Key dates

• Filing date: Mar 31, 2008
• Grant date: Dec 28, 2010
• Expiry date: May 3, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/026

Abstract

A vertically-integrated image sensor includes a sensor wafer connected to a support circuit wafer. Each pixel region on the sensor wafer includes a photodetector, a charge-to-voltage conversion mechanism, a transfer mechanism for transferring charge from the photodetector to the charge-to-voltage conversion mechanism, and a reset mechanism for discharging the charge-to-voltage conversion mechanism. The support circuit wafer includes an amplifier and other support circuitry for each pixel region on the sensor wafer. An inter-wafer connector directly connects each charge-to-voltage mechanism on the sensor wafer to a respective gate to an amplifier on the support circuit wafer.