Heat dissipation structure
US7859843B2 · kind B2 · utility
2Cited by
22References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 6, 2009 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Jun 3, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation structure includes an electronic device, and a cooling device mounted to the electronic device. The electronic device includes a housing, and a heat generating element mounted in the housing. The housing defines an opening. The cooling device comprises a shell abutting against the heat generating element through the opening, a number of fins extending from the shell, a fan mounted to the shell, an air intake, and an air outlet. The air intake and the air outlet are located outside the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.