Lead retention assembly for implantable medical device
US7860568B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2008 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Apr 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A lead retention assembly for an implantable medical device includes (i) a conductive set screw and (ii) a housing defining an opening for receiving at least a portion of the set screw. The assembly further includes a block disposed within the housing. The block defines a lead receiving bore and a second bore extending generally perpendicular to and intersecting with the lead receiving bore. The assembly further includes a conductive lead engagement member having a lead engagement feature. The lead engagement feature is disposed within and movable within the second bore such that advancement of the set screw causes the lead engagement feature to move within the second bore towards the lead receiving bore. The set screw is electrically isolated from the conductive lead engagement member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.