Pattern forming method and pattern forming apparatus
US7862761B2 · kind B2 · utility
263Cited by
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4Claims
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Key dates
| Filing date | May 24, 2007 |
| Grant date | Jan 4, 2011 |
| Priority date | — |
| Expiry date | Dec 26, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A pattern forming method for forming a pattern on a pattern forming material on a substrate by using an imprint pattern provided to a mold is constituted by preparing a substrate having thereon a pattern forming area, disposing the pattern forming material placed in an uncured state in the pattern forming area in a dispersion state at a plurality of positions at different intervals, and curing the pattern forming material in a state in which the pattern forming material is deformed in a shape corresponding to a shape of the imprint pattern provided to the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.