Curable organopolysiloxane resin composition and optical part molded therefrom
US7863392B2 · kind B2 · utility
13Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2006 |
| Grant date | Jan 4, 2011 |
| Priority date | — |
| Expiry date | Jun 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable organopolysiloxane resin composition having a viscosity at 25° C. in the range of 0.001 to 5,000 Pa·s, a total acid number as specified by JIS K 2501 (1992) in the range of 0.0001 to 0.2 mg/g, and light transmittance in a cured state equal to or greater than 80%; an optical part comprised of a cured body of the aforementioned composition. The curable organopolysiloxane resin composition of the invention is characterized by good transparency, low decrease in transmittance when exposed to high temperatures, and excellent adhesion when required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.