Bonded wafer package module
US7863699B2 · kind B2 · utility
19Cited by
14References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2008 |
| Grant date | Jan 4, 2011 |
| Priority date | — |
| Expiry date | May 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/411
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Bonded wafer packages having first and second wafers bonded together forming a matrix of sealed devices, at least one of the wafers having a plurality of passive devices formed thereon, including at least one BAW resonator within each of the sealed devices, the first wafer having conductor filled through-holes forming electrical connections between the passive devices and connections assessable from outside the sealed devices, the bonded wafers being diced to form individual sealed devices. The devices may be duplexers, interstage filters or other circuits such as VCOs and RF circuits. Various embodiments are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.