System and method of film capacitor cooling
US7864506B2 · kind B2 · utility
13Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2007 |
| Grant date | Jan 4, 2011 |
| Priority date | — |
| Expiry date | Mar 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Film capacitor assembly has a plurality of film capacitive layers for storing an electric charge. The plurality of film capacitive layers have a first metal contact and a second metal contact. A heat sink removes heat from the plurality of film capacitive layers. The heat sink is in thermal conductive communication with at least one of the first metal contact and the second metal contact. A dielectric material is configured to prevent a transmission of electric current through the heat sink from the plurality of film capacitor capacitive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.