Heat dissipation device
US7864526B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Jun 25, 2009 |
| Grant date | Jan 4, 2011 |
| Priority date | — |
| Expiry date | Jun 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device for cooling an electronic device mounted on a printed circuited board includes a heat sink thermally contacting the electronic device, a fan defining a plurality of through holes in a periphery thereof and a fixing device fixing the fan on a side of the heat sink. A plurality of fasteners are attached on a bottom of the heat sink and fasten the heat sink on the printed circuited board. The fasteners block the through holes in a bottom of the fan. The fixing device includes fixing brackets attached to the heat sink and a plurality of resilient connecting devices. Each resilient connecting device has an end extending through a corresponding through hole in the bottom of the fan and connected to the fan, and another end connected to a bottom of a corresponding fixing bracket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.