Method of manufacturing metal keypad panel with micropore array
US7866032B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2007 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Apr 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a method of manufacturing a metal keypad panel with a micropore array, a metal laminate is prepared and etched to form micropores on the metal laminate, and a filling is coated on a surface of the metal laminate and permeated into the micropores. After the metal laminate is punched to form a metal keypad panel in a predetermined shape, the metal keypad panel is put into a mold. After a plastic material is injected into the mold, a pattern layer is formed on a side of the metal keypad panel, and then a backlight module is attached onto another side of the metal keypad panel. The backlight module has patterns, and the shape of the patterns is formed by arranging light guide microstructures. Finally, an electric signal module is attached onto a side of the backlight module to complete manufacturing the metal keypad panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.