Method of flatting evaporating section of heat pipe embedded in heat dissipation device
US7866043B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 28, 2008 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Apr 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49353
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.