Pre-treatment process for liberation of metals from waste printed circuit boards using organic solution
US7867317B2 · kind B2 · utility
2Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2008 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Sep 28, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49751
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for recovering valuable metals contained in printed circuit boards of waste electronic machine, and more particularly, a method for liberating metal and plastic laminated in waste printed circuit boards uses an organic solvent and then separates and recovers the liberated metal components using an electrostatic separation process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.