Method for realizing a multispacer structure, use of said structure as a mold and circuital architectures obtained from said mold
US7867402B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2006 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Nov 11, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/888
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method realizes a multispacer structure including an array of spacers having same height. The method includes realizing, on a substrate, a sacrificial layer of a first material; b) realizing, on the sacrificial layer, a sequence of mask spacers obtained by SnPT, which are alternately obtained in at least two different materials; c) chemically etching one of the two different materials with selective removal of the mask spacers of this etched material and partial exposure of the sacrificial layer; d) chemically and/or anisotropically etching the first material with selective removal of the exposed portions of the sacrificial layer; e) chemically etching the other one of the two different materials with selective removal of the mask spacers of this etched material and obtainment of the multispacer structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.