Metal deposition
US7867686B2 · kind B2 · utility
4Cited by
10References
19Claims
0Family size
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Inventors
Key dates
| Filing date | Feb 10, 2005 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Dec 3, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for electroless plating of metal on a laser-patterned substrate. A substrate is provided on which both a thermal imaging layer and catalytic layer are deposited. On exposure to a laser beam, sufficient levels of radiation are converted to heat in the thermal imaging layer to render the exposed regions of the adjacent catalytic layer inactive. The laser-patterned substrate is then exposed to a reaction solution which initiates the growth of a metal film on the unexposed regions of the catalytic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.