Method of fabricating organic light emitting diode display device
US7867797B2 · kind B2 · utility
2Cited by
5References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 12, 2008 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Sep 12, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/1201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method of fabricating organic light emitting diode display, a planarization layer is annealed, cured, provided with an ashing treatment, and surface-treated to reduce roughness of the planarization layer. Therefore, it is possible to improve reduce problems such as a decrease in reflectivity and variation of color coordinates of the organic light emitting diode display due to the roughness of the planarization layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.