Electronic component structure and method of making
US7867806B2 · kind B2 · utility
3Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2007 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Sep 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semiconductor die using non-conductive adhesive and wire bonded to bond pads on the semiconductor die and/or to pads on a substrate to which the semiconductor die is attached.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.