Radio frequency module assembly
US7868258B2 · kind B2 · utility
0Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2008 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Jan 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N5/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A radio frequency (RF) module assembly includes a substrate on which a predetermined component is mounted, the substrate comprising a connection terminal, and an RF module mounted on the substrate and processing a predetermined RF signal. The RF module includes a housing forming a body, a jack receiving and transmitting a predetermined RF signal, a jack receiving part provided at the housing to allow the jack to be inserted inside the housing and received, and a terminal connected to a connection terminal of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.