Integrated circuit and sensor for imaging
US7868665B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2003 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Jun 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/331
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
New sensors and different embodiments of multi-channel integrated circuit are provided. The new high energy and spatial resolution sensors use both solid state and scintillator detectors. Each channel of the readout chip employs low noise charge sensitive preamplifier(s) at its input followed by other circuitry. The different embodiments of the sensors and the integrated circuit are designed to produce high energy and/or spatial resolution two-dimensional and three-dimensional imaging for widely different applications. Some of these applications may require fast data acquisition, some others may need ultra high energy resolution, and a separate portion may require very high contrast. The embodiments described herein addresses all these issues and also other issues that may be useful in two and three dimensional medical and industrial imaging. The applications of the new sensors and integrated circuits addresses a broad range of applications such as medical and industrial imaging, NDE and NDI, security, baggage scanning, astrophysics, nuclear physics and medicine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.